Chapter 1011 Kidnapping
"The future of silicon-based semiconductors is predictable, but our previous investment cannot be stranded, so we have not stopped pursuing further reduction of failure rate while maintaining device characteristics.
As a technology supplier, we are always looking for ways to achieve higher performance with new equipment, and we are also adjusting the manufacturing process in the fab.
In the fab, we use many innovative process steps for planar gate and trench gate power. Innovation means many mistakes and difficult compatibility. Round scrapping.
For example, thicker, lightly doped stacks support higher breakdown voltages but increase on-resistance.
Therefore, in order to form trenches on the device, in some cases, the trench size has been reduced to 1 μm (micrometer) or even smaller.
To form the trenches, we have to deposit another mask layer over the device and implant dopants into it.
The trenches are patterned, then etched, and finally the source and drain are formed as the trenches are filled with gate material.
Each of these steps is extremely important. What we need to thank is the technical support provided by an official etching research institute in Daxia, which allows us to use the world's top etching technology. "
From wafer to wafer cutting, etching, lithography to make chips, and later, Gu Qing even explained to the senior executives of these technology companies the direction and specific solutions for some semiconductor chip problems of his Kyushu technology company.
"The so-called 3D three-dimensional chip in the West is actually the same thing as our previous stacked chip. It is like building a house by stacking chips layer by layer, from a set of bungalows to a multi-storey residential building.
What a chip can do is limited, and its performance is also fixed. If multiple chips are installed on a flat surface, although the performance of the overall processor can be improved, it will cause the core chip template area of the processor to be too large. Large, and there are too many wire connectors, which is easy to cause failure.
The 3D three-dimensional chip and our stacked chip can stack the chips one by one to achieve more powerful performance under the same area.
However, this technology will make it extremely difficult to solve the heat dissipation problem of the chip. Once the chip has a problem, the processor must be replaced, and there is no possibility for consumers to change a single chip.
Moreover, the processor with a 3D stacking structure also poses a great test to the stability of the semiconductor chip. During the installation and use process, a single bump and shake may cause chip failure.
The chip technology developed by the group of Western technology companies has been researched by our company's semiconductor engineers. The silicon-based semiconductor technology we cooperated with the outside world this time is fully capable of stacking chip technology. Basically, we can make chips that are at least three generations ahead of Western technology companies. chip products.
If the partner wants to further participate by himself, he can also contact and communicate with other upstream and downstream technology companies using our technology to develop the structure and design by himself. Although there will be no very powerful chips in the short term, as long as the rules and methods are mastered , then it is completely possible to replace the structure every three years, or even upgrade the structure once every two years.
It's just that I still hope that the partners can be good students first, study hard, and then have enough foundation and experience, and then carry out R\u0026D and design by themselves, and the project of designing chips also requires a strong enough team of engineers to complete.
At present, domestic and foreign enterprises, research institutions and even official organizations have a strong desire for students, mentors and working staff in this industry.
Friends who have ideas about this project, it is best to contact domestic universities to communicate clearly. After all, it is impossible for our company’s technology to be spread abroad without passing the application review and approval, even if it is to the overseas branch of a domestic company. Those who master our technology need to apply for a report every time. "
In all honesty, Gu Qing spoke very seriously. It can even be said that he has no secrets in many projects. He not only clearly explained the advantages and disadvantages of the technology, but also made the specificity of the project clear.
The high-level executives of a group of technology companies heard that the mountains and rivers between their eyebrows were no longer ugly, but extremely distorted and weird.
We all know that Kyushu Technology has a close cooperation with the government, but how did you come up with so many technically sensitive points and prohibited projects? Even asked the government to set up a special department to manage it?
Which of the Xiawei, Biati, and Ningde companies present here has no cooperation with the government? Which one is not a well-known presence in the industry?
But the cooperation is so close, and even some core systems are uploaded to the official platform, just like that, there is no technical support and technical protection treatment like Kyushu Technology!
Yu Chengdong took a deep breath, pinched his nose with his right hand, and narrowed his eyes slightly.
Our own Kirin chip used to be optimized and developed based on the arm architecture, and later learned the chip structure of Kyushu Technology, but so far, Xia Wei still has not "learned out of the teacher".
Only by entering the world of Kyushu's semiconductor field can one understand how terrifying Kyushu technology is.
The young man in front of him actually supports the semiconductor department to develop chips directly from the bottom layer, not only abandoning the MIPS instruction set, but also self-developed instruction set architecture, self-developed AI processor, self-developed program software, and even design and development in the production process Industrial software platform and intelligent AI assistance.
It is already so scary, Kyushu Technology also has the most powerful robotic arm and process manufacturing dust-free workshop in the industry!
These technologies are not only extremely important to the semiconductor chip industry, but also to the production and development of other high-tech products.
And those semiconductor switching parts...
In the ocean of hundreds of millions of transistors, small switches are precisely made.
Even if Gu Qing introduced that the chips of Kyushu Technology and the 3D chips made by Western technology companies are not too different in terms of internal architecture and technical directions, they all change the arrangement and structure of countless transistors inside the chip to build a sufficiently powerful performance architecture. computing performance.
But the comparison of sorting and structure, optimized operation and energy consumption ratio is too powerful, right?
According to the data given by Gu Qing, as long as Kyushu Semiconductor's technology is used and the chip is carefully developed, at most two years, it can develop a chip that is twice as powerful as Pingguo's latest chip!
When the time comes to move the self-developed chip to the 3D structure, it will be a terrible performance improvement!
At this moment, Yu Chengdong really had the urge to kidnap Gu Qing.
